Serial Wire Multi Drop

This site uses cookies. By continuing to browse this site, you are agreeing to our Cookie Policy.

  • Serial Wire Multi Drop

    Hello,

    My plan is to validate that I can address both a Freescale Kinetis KXX (Cortex-M4) and a Kinetis KLXX (Cortex-M0+) on a same board using a single debug connector.
    As Kinetis L serie has only Serial Wire interface (so JTAG chaining seems not to be an option), I imagine connecting both MCUs in parallel on SWDIO and SWDCLK and use the multi-drop extensions defined as part of Serial Wire protocol version 2 in ADI (ARM Debug Interface) v5.1.

    I briefly tried to connect two TWRK40 boards in such parallel configuration but I manage to connect to only one of the two targets.


    My questions are the following :
    - Does J-Link already allow to address multiple targets through a single Serial Wire connection ?
    - If not, is there a plan to do so ?
    - What is your feeling about such plan ?

    Kind regards,
  • Hi,

    SWD Multi-drop is not supported yet.
    There are definitely plans to support this but I can not give you a schedule yet.
    I will check internally.


    Best regards
    Alex
    Please read the forum rules before posting.

    Keep in mind, this is *not* a support forum.
    Our engineers will try to answer your questions between their projects if possible but this can be delayed by longer periods of time.
    Should you be entitled to support you can contact us via our support system: segger.com/ticket/

    Or you can contact us via e-mail.
  • Hi,

    I checked this and we plan to add support for SWD multi-drop sometime this year.


    Best regards
    Alex
    Please read the forum rules before posting.

    Keep in mind, this is *not* a support forum.
    Our engineers will try to answer your questions between their projects if possible but this can be delayed by longer periods of time.
    Should you be entitled to support you can contact us via our support system: segger.com/ticket/

    Or you can contact us via e-mail.