Unable to flash R7FA2A2AD

Hello,

I am trying to erase and then flash a R7FA2A2AD MCU. This MCU is contained into the Renesas EK-RA2A2 evaluation kit.

I have the evaluation kit configured in this way: J6 closed, J8 on 1-2 pins, J9 closed, J29 jumpers on pins 1-2, 3-4, 5-6, 7-8 according to the users manual of EK.

There is one J-Link OB included in the EK-RA2A2 but I want to perfrom some operations with Jflash but it looks like the OB variant doesn't work with J-Flash.

At the erase time I got the error:

- ERROR: Timeout while preparing target, RAMCode did not respond in time!
- ERROR: Failed to perform RAMCode-sided Prepare()

I am using a J-Link PLUS compact, with updated firmware (Feb 20 2025) and Jlink Package v8.24

Please see the attached log.

Any idea, suggestion on what to do?

Thanks,

Connecting ...
- Connecting via USB to probe/ programmer device 0
- Probe/ Programmer firmware: J-Link V12 compiled Feb 20 2025 16:24:27
- Probe/ Programmer S/N: 852005764
- Device "R7FA2A2AD" selected.
- Target interface speed: 4000 kHz (Fixed)
- VTarget = 3.341V
- InitTarget() start
- Identifying target device...
- SWD selected. Executing JTAG -> SWD switching sequence...
- Initializing DAP...
- DAP initialized successfully.
- Attach to CPU failed. Trying connect under reset.
- Identifying target device...
- SWD selected. Executing JTAG -> SWD switching sequence...
- Initializing DAP...
- DAP initialized successfully.
- Low power mode detected. Waking device from low power mode.
- InitTarget() end - Took 220ms
- Found SW-DP with ID 0x5BA02477
- DPIDR: 0x5BA02477
- CoreSight SoC-400 or earlier
- Scanning AP map to find all available APs
- AP[2]: Stopped AP scan as end of AP map has been reached
- AP[0]: AHB-AP (IDR: 0x74770001, ADDR: 0x00000000)
- AP[1]: APB-AP (IDR: 0x44770002, ADDR: 0x01000000)
- Iterating through AP map to find AHB-AP to use
- AP[0]: Core found
- AP[0]: AHB-AP ROM base: 0x4001A000
- CPUID register: 0x411CD200. Implementer code: 0x41 (ARM)
- Feature set: Baseline
- Cache: No cache
- Found Cortex-M23 r1p0, Little endian.
- FPUnit: 4 code (BP) slots and 0 literal slots
- Security extension: not implemented
- CoreSight components:
- ROMTbl[0] @ 4001A000
- [0][0]: E000E000 CID B105900D PID 000BBD20 DEVARCH 47702A04 DEVTYPE 00 Cortex-M23
- [0][1]: E0001000 CID B105900D PID 000BBD20 DEVARCH 47701A02 DEVTYPE 00 DWT
- [0][2]: E0002000 CID B105900D PID 000BBD20 DEVARCH 47701A03 DEVTYPE 00 FPB
- [0][3]: 40019000 CID B105900D PID 000BBD20 DEVARCH 47710A31 DEVTYPE 31 MTB
- Executing init sequence ...
- Initialized successfully
- Target interface speed: 4000 kHz (Fixed)
- Found 1 JTAG device. Core ID: 0x5BA02477 (None)
- Connected successfully
Erasing chip ...
- 275 sectors, 3 ranges, 0x0 - 0x7FFFF, 0x1010008 - 0x1010033, 0x40100000 - 0x40101FFF
- Start of determining flash info (Bank 0 @ 0x00000000)
- End of determining flash info
- Flash bank info:
- 256 * 2 KB @ 0x00000000
- Start of preparing flash programming
- ERROR: Timeout while preparing target, RAMCode did not respond in time!
- ERROR: Failed to perform RAMCode-sided Prepare()
- End of preparing flash programming
- Start of restoring
- End of restoring
- ERROR: Failed to erase chip
Disconnecting ...
- OnDisconnectTarget() start
- Restoring low power mode settings.
- OnDisconnectTarget() end - Took 2.67ms
- Disconnected

Hi, thanks for the answer.

Yes, using JLink-OB it works without problem, but using an external J-Link doesn't work for me.

For our development we need to use an external Jlink with our custom hardware.

Regards,